About this position
The following reflects management’s definition of essential functions for this job but does not restrict the tasks that may be assigned. Management may assign or reassign duties and responsibilities at any time due to reasonable accommodation or other reasons.
Engineer I
- Implement and test simple RF building blocks (filters, couplers) from established schematics.
- Run directed simulations (ADS/HFSS/CST); document results and perform basic parameter sweeps.
- Execute bench measurements using VNAs and spectrum analyzers; record first-order data.
- Support BOM creation and EOL data gathering.
- Collaborate with mechanical/software teams on interface details.
- Collect and organize test data accurately, perform basic trend analysis, and prepare clear charts and summary reports under guidance.
Engineer II
- Iterate LNAs/PAs and mixer front ends designs; address biasing, stability, and matching networks.
- Perform simulations; correlate model-to-measurement; refine designs to meet gain, NF, and linearity.
- Develop and execute test plans; interpret results to drive corrective actions.
- Partner with manufacturing on thin-film/PCB/box-build considerations; incorporate DFM/DFT feedback.
- Create accurate BOMs with alternates; assist with EOL analysis.
- Proficient in analyzing RF performance data (gain, noise figure, linearity) and correlating results with simulation outputs. Capable of generating structured reports that include observations, root-cause hypotheses, and recommended corrective actions for review by senior engineers.
Engineer III (Senior)
- Architect and lead subsystem designs (up/down-converters, mixers, synthesizers); balance gain, NF, linearity, spurious, and thermal stability.
- Own model-to-hardware correlation; employ EM/circuit co-simulation and statistical analyses.
- Direct rigorous validation using VNAs, spectrum analyzers, and custom fixtures; interpret complex data.
- Lead manufacturability integration; manage NPI transitions and reliability/yield tradeoffs.
- Perform EOL analysis; select replacements and manage compliance impacts.
- Interpret complex RF test datasets and simulation results to validate subsystem performance. Prepare comprehensive technical reports for internal design reviews, and customer review meetings.
- Mentor junior engineers and lead design reviews.
Engineer IV (Staff/Principal)
· Define and oversee RF product architectures and integration into complete systems.
· Lead advanced RF design efforts for converters, amplifiers, and complex thin-film circuits; resolve multi-physics/EM interactions.
· Establish performance optimization frameworks and acceptance criteria; mentor teams to those standards.
· Innovate in simulation/modeling; codify best practices/tool flows.
· Direct complex validation campaigns; adjudicate data for architecture-level decisions.
· Drive manufacturability/reliability strategies across thin-film, PCB, and box-build; partner with Operations.
· Own component lifecycle management and BOM standards; review high-impact bids.
· Act as technical liaison across mechanical/software; represent engineering in major customer/executive reviews.
· Produces executive-ready/customer-facing technical reports and white papers that articulate design trade-offs, risk assessments, and compliance impacts. Sets standards for data integrity and reporting practices across engineering teams.
· Guide adherence to government contract flow-downs and export controls; help scope Technical Assistance Agreements.
Salary Information
Requirements
Basic Qualifications:
- Bachelor’s degree in Electrical Engineering or a related technical discipline
- US Citizenship required for compliance.
- Excellent written and oral communication skills.
Technical Qualifications by Level
Engineer I
- 0-2 years RF design and test experience
- Familiarity with RF test equipment (VNA, spectrum analyzer) and basic RF theory.
Engineer II
- MS in RF/Microwave preferred.
- 2–5 years RF design and test experience; proficiency with ADS/HFSS/CST and RF lab equipment.
- Strong understanding of EM theory, impedance matching, and signal integrity.
Engineer III (Senior)
- MS strongly preferred.
- 5–10 years RF design experience across amplifiers, converters, and thin-film circuits; expertise with ADS/HFSS/CST and RF testing methodologies.
- Familiarity with RF manufacturing processes; strong compliance knowledge.
Engineer IV (Staff/Principal)
- MS strongly preferred.
- 10+ years hands-on RF design with production delivery; expert in simulation tools and advanced RF test methodologies.
- Deep expertise in EM theory, impedance matching, and signal integrity; fluency in RF manufacturing processes.